使用者指南

使用者指南
Specifications: Dell Dimension Vxxx and Vxxxc Systems

Specifications: Dell Dimension Vxxx and Vxxxc Systems

General | System Information | Expansion Bus | Memory | Drives | Ports | Audio | NIC | Video | Controls and Indicators | Power | Physical | Environmental | Regulatory Notices


General

Microprocessor type

Intel Celeron™ with MMX™ technology

runs at 333, 400, 433, or 466 MHz internally/66 MHz externally

Intel Pentium II with MMX technology

runs at 333 MHz internally/66 MHz externally; 350 MHz internally/100 MHz externally; 400 MHz internally/100 MHz externally
Compatibility speed set through the system setup program
L1 cache 32 KB (16-KB data cache; 16-KB instruction cache)
L2 cache:

Intel Celeron

128-KB pipelined write-back SRAM internal to the processor core that runs at the processor’s internal speed

Intel Pentium II

512-KB pipelined write-back SRAM on the single-edge contact (SEC) cartridge or SECC2 package that runs at half the processor’s internal speed
Microprocessor mounting

Intel Celeron

single-edge processor package (SEPP) connected to the system board contains microprocessor and cache circuitry

Intel Pentium II

SEC cartridge or SECC2 package connected to the system board contains microprocessor and cache circuitry
Math coprocessor internal to microprocessor

System Information

System chip set Intel 440BX AGPset
Data bus width 64 bits
Address bus width 32 bits
DMA channels seven
Interrupt levels 15
System BIOS chip 4 Mb (512 KB)
System clock 100 or 66 MHz (matches external processor speed)
Diskette/communications ports 48 MHz from the system clock

Expansion Bus

Bus types ISA, PCI (version 2.1), and AGP
ISA expansion-card connectors two (one shares a card-slot opening with a PCI connector)
ISA expansion-card connector size 98 pins
ISA expansion-card connector data width (maximum) 16 bits
PCI expansion-card connectors three (one shares a card-slot opening with an ISA connector)
PCI expansion-card connector size 120 pins
PCI expansion-card connector data width (maximum) 32 bits
Shared expansion-card slots one (slot contains both an ISA and a PCI connector, only one of which can be used at any given time)
ISA bus frequency 8.33 MHz
PCI bus frequency 33 MHz
AGP bus frequency 133 MHz
Plug and Play revision 1.2
PCI bus specification complies with PCI specification 2.1
PCI-to-PCI bridging supported

Memory

Architecture non-ECC SDRAM modules
DIMM sockets three
DIMM capacities 32, 64, and 128 MB
Minimum RAM 32 MB (non-ECC)
Maximum RAM 384 MB
Frequency 100 MHz
Clock cycle 10 ns (supports 4 clocks only)
CAS latency three
SPD revision 1.2
Buffering unbuffered
Voltage 3.3 V
Data bus width 8 bits
BIOS address F0000h
NOTE: The system supports only non-ECC memory. Non-ECC DIMMs have eight memory chips on the module.

Drives

Mini tower chassis:

Externally accessible bays

five total: two 5.25-inch bays for diskette, tape, or CD-ROM drives; three 3.5-inch bays for diskette or tape drives

Internally accessible bays

two bays for 1-inch-high EIDE hard-disk drives
Desktop chassis (available only in certain locations):

Externally accessible bays

four total: two 5.25-inch for diskette, tape, or CD-ROM drives; two 3.5-inch bays for diskette or tape drives

Internally accessible bays

two bays for 1-inch-high EIDE hard-disk drives

Ports

Externally accessible:

Serial (DTE)

9-pin connector; 16550C-compatible

Parallel

25-hole connector (bidirectional)

PS/2-style keyboard

6-pin mini-DIN connector

PS/2-compatible mouse

6-pin mini-DIN connector

MIDI/game1

15-pin connector

Video

15-hole connector

Audio1

three miniature jacks for LINE IN, LINE OUT, and MIC IN

NIC2

RJ45 connector

USB

two USB-compliant connectors
Internally accessible:

Primary EIDE

40-pin connector on PCI local bus

Secondary EIDE

40-pin connector on PCI local bus

Diskette drive

34-pin connector
1 Available only in systems with integrated audio
2 Available only in systems with integrated NIC

Audio

Audio integrated Yamaha DS-1

NIC

NIC integrated Intel EtherExpress Pro/100B

Video

Video integrated ATI Rage Pro AGP 2X
Video memory 8 MB SDRAM

Controls and Indicators

Reset control push button
Power control push button
Power indicator green
Hard-disk drive access indicator green
Network indicators (optional) green and yellow
Diagnostic code indicators four yellow and green

Power

DC power supply:

Wattage

200 W

Voltage

90 to 135 V at 60 Hz;
180 to 265 V at 50 Hz

Heat dissipation

778 BTU (fully loaded system without monitor)
Battery 3-V CR2032 coin cell

Physical

Mini tower chassis:

Height

43.69 cm (17.2 inches)

Width (with base)

20.32 cm (8 inches)

Depth

44.45 cm (17.5 inches)

Weight

11.3 to 13.6 kg (25.0 to 30.0 lb)
Desktop chassis:

Height

16.00 cm (6.3 inches)

Width

42.42 cm (16.7 inches)

Depth

44.45 cm (17.5 inches)

Weight

11.3 to 13.6 kg (25.0 to 30.0 lb)

Environmental

Temperature:

Operating

10� to 35�C* (50� to 95�F)

Storage

–40� to 65�C (–40� to 149�F)
Relative humidity 20% to 80% (noncondensing)
Maximum vibration:

Operating

0.25 G at 3 to 200 Hz at 1/2 octave/min

Storage

0.5 G at 3 to 200 Hz at 1/2 octave/min
Maximum shock:

Operating

left side (for mini tower orientation) and bottom half-sine pulse with a change in velocity of 50.8 cm (20 inches)/sec

Storage

23-G faired-square wave with a velocity change of 508.0 cm (200 inches)/sec
Altitude:

Operating

–16 to 3048 m* (–50 to 10,000 ft)

Storage

–16 to 10,600 m (–50 to 35,000 ft)
* At 35�C (95�F), the maximum operating altitude is 914 m (3000 ft).

Regulatory Notices

FCC (U.S. only) Class B
IC Notice (Canada only) Class B
CE Notice Class B
VCCI Notice (Japan only) Class B
NOM O24 Information (Mexico only)

 

 

 

 

 

 

 

 

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